T 37: Silicon trackers 2
Tuesday, March 5, 2024, 16:00–18:00, Geb. 30.22: kl. HS B
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16:00 |
T 37.1 |
Assembly and testing of ATLAS ITk pixel detector modules during the production phase — Patrick Ahlburg, Yannick Dieter, Fabian Hügging, Florian Hinterkeuser, Hans Krüger, Maximilian Mucha, •Matthias Schüssler, and Jochen Dingfelder
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16:15 |
T 37.2 |
ITk Pixel DCS: Pixel System Monitoring Readout — •Anne Gaa and Stan Lai
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16:30 |
T 37.3 |
Bump connectivity and efficiency studies on ATLAS ITkPix using a high intensity X-Ray beam — Yannick Dieter, Fabian Hügging, Hans Krüger, •Andreas Ulm, Marco Vogt, and Jochen Dingfelder
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16:45 |
T 37.4 |
Performance of CMS Inner Tracker pixel assemblies for the Phase-2 Upgrade — •Bianca Raciti, Massimiliano Antonello, Erika Garutti, Chin-Chia Kuo, Jörn Schwandt, and Georg Steinbrück
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17:00 |
T 37.5 |
Quality control for the production of multi-chip modules for CMS Inner Tracker — •Chin-Chia Kuo, Massimiliano Antonello, Erika Garutti, Bianca Raciti, Jörn Schwandt, and Georg Steinbrück
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17:15 |
T 37.6 |
Test Beam Analysis of Irradiated, Passive CMOS Strip Sensors — •Fabian Lex for the CMOS Strips collaboration
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17:30 |
T 37.7 |
Characterisation and TCAD Simulation of Stitched, Passive CMOS Strip Sensors — •Iveta Zatocilova for the CMOS Strips collaboration
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17:45 |
T 37.8 |
Characterisation and Simulation of stitched CMOS Strip Sensors — •Naomi Davis for the CMOS Strips collaboration
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