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T: Fachverband Teilchenphysik

T 61: Silicon trackers 3

T 61.2: Vortrag

Mittwoch, 6. März 2024, 16:15–16:30, Geb. 30.22: kl. HS B

Quality control at wafer level and thermocycling of ATLAS ITk pixel detector modules during the production phase — Patrick Ahlburg, Yannick Dieter, Fabian Hügging, Hans Krüger, Konstantin Mauer, •Maximilian Mucha und Jochen Dingfelder — Physikalisches Institut, Universität Bonn, Germany

The upgrade of the Large Hadron Collider (LHC) to the High-Luminosity LHC (HL-LHC) presents significant technological challenges. The HL-LHC will see an increase in instantaneous luminosity by a factor of 5, leading to higher hit rates and radiation levels than ever before. To cope with these demanding conditions, extensive upgrades to the detectors are necessary. As part of the upgrade, the ATLAS Inner Detector will be replaced by a new all-silicon inner tracking detector (ITk detector) consisting of silicon strip and hybrid pixel modules. In total, approximately 10.000 new pixel detector modules have to be built and carefully tested to ensure that only fully functional detector modules will be installed. The QC process starts already at wafer level. For the hybrid modules, 131 readout chips on approx. 700 wafers have to be tested for their functionality.

This talk provides an overview of the fully automated testing procedures developed for the ATLAS ITk pixel detector modules at the Forschungs- und Technologiezentrum Detektorphysik (FTD) in Bonn. It focuses on the wafer probing setup and the module-level thermocycling setup, which are crucial for ensuring the functionality and quality of the detector modules.