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Q: Fachverband Quantenoptik und Photonik

Q 75: Quantum Technologies (Solid State Systems) (joint session Q/QI)

Q 75.6: Vortrag

Freitag, 14. März 2025, 15:45–16:00, HS I

Hybrid integration of silicon carbide color centers into photonic integrated circuitry — •Jan Riegelmeyer, Gerben Timmer, Keyuan Fang, Maurice van der Maas, Elena Volkova, Kees Koot, Ryoichi Ishihara, Tim Taminiau, and Carlos Errando Herranz — QuTech and Kavli Institute of Nanoscience, Delft University of Technology, Delft 2628 CJ, Netherlands

Color centers in the solid-state are promising qubit candidates for quantum information processing, but scaling to practical systems requires significantly increasing the number of qubits within a single processing unit. A solution to this challenge is integrating color centers into photonic integrated circuits (PICs) for efficient and miniaturized photon collection, manipulation, and detection. However, traditional color center host materials like silicon carbide (SiC), lack well-established PIC technology, limiting scalability. Here, we address this limitation via the hybrid integration of SiC chiplets into silicon nitride (SiN) PICs using micro transfer printing. The chiplets are suspended structures fabricated from 4H-SiC-on-insulator containing photonic waveguides and cavities designed for the V2 color center. We optimized the geometry of chiplet and PIC to ensure reliable transfer printing and efficient optical transmission and demonstrate successful hybrid integration. While optimized for SiC color centers, our approach applies to other color center host materials.

Keywords: Color Centers; Silicon Carbide; Hybrid Integration; Transfer Printing; Integrated Photonics