Göttingen 2025 – wissenschaftliches Programm

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T: Fachverband Teilchenphysik

T 27: Silicon Detectors III (ATLAS + CMS production)

T 27.1: Vortrag

Dienstag, 1. April 2025, 16:15–16:30, VG 0.111

Production of Outer Barrel Pixel Detector Modules for the ATLAS ITk Pixel Detector – From Wafer Probing to Assembly — Yannick Dieter, Wolfgang Dietsche, Walter Honerbach, Fabian Hügging, Hans Krüger, •Maximilian Mucha, Matthias Schüssler, and Jochen Dingfelder — University of Bonn, Physikalisches Institut, Nußallee 12, 53115 Bonn, Germany

The High-Luminosity upgrade of the Large Hadron Collider (LHC) aims to enhance its performance by increasing luminosity by a factor of 5. This upgrade introduces unprecedented challenges for the ATLAS detector, driven by elevated hit rates and radiation levels far exceeding current operational conditions. To address these challenges, the ATLAS Inner Detector will be replaced with the new all-silicon Inner Tracking Detector (ITk).

The ITk production phase involves the assembly of approximately 10,000 hybrid pixel detector modules, each of which must meet strict quality requirements to ensure reliable performance. The process begins with functionality testing at wafer level, where roughly 700 wafers containing 131 readout chips each are characterized to ensure chip functionality. External vendors then hybridize the readout chips with silicon sensor dies to construct bare modules. Subsequently, these bare modules are assembled into fully operational ITkPix modules at dedicated institutes worldwide.

This talk provides an overview of the complete ITkPix module production chain, with a focus on wafer probing and assembly.

Keywords: ATLAS; ITk; ITkPix; LHC; HL-LHC