Göttingen 2025 – wissenschaftliches Programm

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T: Fachverband Teilchenphysik

T 27: Silicon Detectors III (ATLAS + CMS production)

T 27.6: Vortrag

Dienstag, 1. April 2025, 17:30–17:45, VG 0.111

ATLAS ITk Strips sensor cracking mitigation efforts — Jan-Hendrik Ahrling, Sergio Diez, •Konstantin Mauer, and Ingrid Gregor — Deutsches Elektronen-Synchrotron DESY, Hamburg

The upcoming High-Luminosity upgrade of the Large Hadron Collider (HL-LHC) will significantly increase its instantaneous luminosity. This will lead to a higher track density, a higher hit rate and thus an increased amount of radiation damage in the experiments. For this reason, the ATLAS experiment will be upgraded and a new all-silicon inner tracking (ITk) detector has been designed, consisting of strip and pixel detector modules.

The strip modules are glued onto local support structures. During the pre-production for the detector such fully loaded structures where thermal cycled below operational temperatures. A coefficient of thermal expansion (CTE) mismatch in the layers of a module in combination with the gluing method creates localized stress points at low temperatures. This results at fracturing of the sensor accompanied by an early sensor breakdown. To prevent the loss off several detector modules in certain cooling scenarios, a mitigation strategy was sought.

In this talk, alternative methods of loading modules onto the local support are presented which are reducing the amount of stress in the sensor. The measurements comparing these methods and their impact on sensor cracking are discussed.

Keywords: ATLAS; ITk strips; cracking