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HL: Fachverband Halbleiterphysik

HL 29: Poster II

HL 29.59: Poster

Dienstag, 18. März 2025, 18:00–20:00, P1

Integration of quantum dot-based single-photon sources onto silicon photonic platform using micro-transfer printing — •Simon Oberle, Ponraj Vijayan, Simone Luca Portalupi, Michael Jetter, and Peter Michler — Institut für Halbleiteroptik und Funktionelle Grenzflächen, Universität Stuttgart, Germany

Silicon photonics for telecommunications applications has garnered much attention recently. The optical transparency and the large refractive index contrast of silicon in the telecommunication wavelengths allow the implementation of high-density photonic integrated circuits. One disadvantage of silicon photonics is the lack of a native light source due to the indirect band-gap nature of silicon. One potential solution is the integration of III-V material, which offers outstanding optical emission properties, on a silicon platform. The direct growth of III-V materials on silicon is economically favourable and therefore the most desired approach. However, it is challenging because of the large lattice mismatch between the III-V materials and silicon. An alternate approach for large-scale integration is through hybrid integration of III-V structures using micro-transfer printing. Our group has previously developed In(Ga)As quantum dots on GaAs emitting in the telecom C-band. Here, we report our approach to designing and fabricating structures for the hybrid integration of these QDs onto a silicon platform using micro-transfer printing.

Keywords: quantum dots; telecom C-band; hybrid integration; micro-transfer printing