Regensburg 2025 – scientific programme

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HL: Fachverband Halbleiterphysik

HL 9: Oxide Semiconductors I

HL 9.2: Talk

Monday, March 17, 2025, 15:15–15:30, H17

Plasma Plume Deflection and Target Surface Roughness During Pulsed Laser Deposition of Functional Oxides — •Jonas Elz, Holger von Wenckstern, and Marius Grundmann — Leipzig University, Felix Bloch Institute for Solid State Physics, Semiconductor Physics Group, Leipzig, Germany

Pulsed laser deposition (PLD) is a highly flexible, fast and reproducible physical vapor deposition technique that uses a pulsed laser to evaporate a target material, producing an excited laser-induced plasma. Although simple in set-up, modeling the ablation process is difficult because of its non-equilibrium nature due to the high pulse energy incident on a short time scale (20 ns laser pulse width). Ablation of any target material requires optimization of the process parameters. Some targets used in PLD develop a rough surface structure upon longer use that causes the plasma plume to deflect toward the incoming laser beam during the ablation process. Typically, the plume deflection increases until a stable surface morphology is reached. In this work, we present a comparison of the plasma plume deflection with surface roughness and morphology of different PLD targets as measured by laser scanning microscopy. A Python script is used to evaluate plume images to determine the deflection angle.

Keywords: pulsed laser deposition; plasma plume; functional oxides; copper oxide