Regensburg 2025 – wissenschaftliches Programm
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MM: Fachverband Metall- und Materialphysik
MM 9: Poster
MM 9.57: Poster
Montag, 17. März 2025, 18:30–20:30, P1
Analysis of the Crack Formation in Printed Nanosilver Using In Situ Bending Technique — •Lennart Schwan1, Michaela Klöcker1, Michael Feige1, Laila Bondzio2, Thomas Kordisch1, and Sonja Schöning1 — 1Bielefeld Institute for Applied Materials Research (BIfAM), Faculty of Engineering and Mathematics, Bielefeld University of Applied Sciences and Arts — 2Thin Films & Physics of Nanostructures, Bielefeld University, Department of Physics
3D printing is an emerging technology with a wide range of applications. The modern multi-material jetting process, as used in the Nano Dimension Dragonfly Pro LDM, makes it possible to print dielectric and conductive materials in a single process. In addition to electrical circuits such as coils, capacitors, etc., strain gauges can also be printed.
The change in resistance of strain gauges is usually caused by the change in the geometric dimensions of the conductive layer when it is deformed. In the case of the printed material examined in this study, it is also known that the material is permeated by cracks which cause a directional dependence of the electrical conductivity.
The objective of this study is to investigate how these cracks develop during bending and thus also contribute to the change in resistance. For this purpose, a test specimen is loaded under a three-point bending test using a special in situ bending module. In order to investigate the propagation and formation of the cracks, the bending module is positioned in a scanning electron microscope in order to analyze the cracks under loading with a sufficient image resolution.