Regensburg 2025 – wissenschaftliches Programm

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MM: Fachverband Metall- und Materialphysik

MM 9: Poster

MM 9.74: Poster

Montag, 17. März 2025, 18:30–20:30, P1

Hybrid soldering: Interfacial flux-doping of Cobalt nanoparticles hindering the formation and growth of intermetallic compound (IMCs) layers — •Farzad Khodabakhshi^1,2, Irina Wodak¹, Andriy Yakymovych¹, Gerhard Wilde², and Golta Khatibi¹ — ¹Vienna University of Technology — ²University of Münster

The study investigated hybrid nanocomposite soldering of copper components using a lead-free tin-based solder alloy (Sn-3.5 wt% Ag). To suppress the growth of intermetallic compound (IMC) layers, specifically Cu3Sn and Cu6Sn5, at the interface between the solder alloy and the copper substrate during reflow solidification, a modified flux containing cobalt nanoparticles was applied. The research focused on the effects of incorporating cobalt nanoparticles in different fractions, up to 1.0 wt%, on the microstructural development of the soldered joints and the formation of IMC layers. Additionally, the impact of post-soldering aging treatment, conducted at approximately 180°C for extended periods (up to around 20 days), was assessed. The study analyzed how the alloying of cobalt nanoparticles affected the structure of Cu3Sn and Cu6Sn5 IMC layers, as well as the Sn-based solder alloy. This was done using energy-dispersive X-ray spectroscopy (EDS) elemental mapping in conjunction with field emission-scanning electron microscopy (FE-SEM). Furthermore, the microstructural evolutions of the soldered joints, influenced by the contribution of Co-nanoparticles and the aging treatment, were characterized and discussed using electron channeling contrast imaging (ECCI) microscopy.

Keywords: Soldering; Hybrid joints; Co-nanoparticles; IMC-layers formation