Regensburg 2025 – scientific programme
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TT: Fachverband Tiefe Temperaturen
TT 55: Superconducting Electronics: SQUIDs, Qubits, Circuit QED III
TT 55.4: Talk
Friday, March 21, 2025, 10:15–10:30, H36
Low cross-talk modular flip-chip architecture for coupled superconducting qubits — •Sören Ihssen1, Simon Geisert1, Gabriel Jauma2,3, Patrick Winkel1,4,5, Martin Spiecker1, and Ioan M. Pop1,6,7 — 1IQMT, Karlsruhe Institute of Technology, 76131 Karlsruhe, Germany — 2Institute of Fundamental Physics IFF-CSIC, Calle Serrano 113b, 28006 Madrid, Spain — 3Applied Physics Department, Salamanca University, Salamanca 37008, Spain — 4Departments of Applied Physics and Physics, Yale University, New Haven, CT 06520, USA — 5Yale Quantum Institute, Yale University, New Haven, CT 06520, USA — 6PHI, Karlsruhe Institute of Technology, 76131 Karlsruhe, Germany — 7Physics Institute 1, Stuttgart University, 70569 Stuttgart, Germany
We introduce a novel flip-chip architecture designed for an array of coupled superconducting qubits, where each circuit component is housed within its own microwave enclosure. Unlike traditional flip-chip designs, our approach features electrically floating qubit chips, enabling a straightforward and fully modular assembly of capacitively coupled components, including qubits, control systems, and coupling structures. This design minimizes crosstalk among components. We validate our concept using a chain of three nearest-neighbor coupled generalized flux qubits, with the central qubit functioning as a frequency-tunable coupler. Through this coupler, we achieve a transverse coupling on/off ratio of approximately 50, zz-crosstalk below 1.4 kHz between resonant qubits, and over 70 dB of isolation between the qubit enclosures.
Keywords: flip-chip; flux qubits